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| 无铅锡膏常见的问题和解决方法 |
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来源： 人气：2275 发布时间：2012-08-27
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焊膏的回流焊接是用在SMT装配工艺中的主要板级互连方法，这种焊接方法把所需要的焊接特性极好地结合在一起，这些特性包括易于加工、对各种SMT设计有广泛的兼容性，具有高的焊接可靠性以及成本低等。
Solder paste reflow soldering is used in the SMT assembly process in the main board level interconnect method, the welding method to the needs of the welding qualities together, these characteristics include easy processing, all kinds of SMT design with wide compatibility, high reliability and low cost welding.
然而，在回流焊接被用作为更重要的SMT元件级和板级互连方法的时候，它也受到要求进一步改进焊接性能的挑战，事实上，回流焊接技术能否经受住这一挑战将决定焊膏能否继续作为首要的SMT焊接材料，尤其是在超细微间距技术不断取得进展的情况之下。
However, in a reflow soldering is used as the most important SMT component level and board level interconnect method of the time, it was also requires further improvement of welding performance challenges, in fact, reflow soldering technology can withstand this challenge will decide whether continue to serve as the first SMT solder paste solder material, especially in super fine pitch technology progress in the circumstances.
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