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| 焊接使用无铅锡膏的主要成分 |
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来源： 人气：2337 发布时间：2012-08-26
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在无铅锡膏在成分中，主要是由锡/银/铜三部分组成，由银和铜来代替原来的铅的成分。根本的特性和现象在锡/银/铜系统中，锡与次要元素(银和铜)之间的冶金反应是决定应用温度、固化机制以及机械性能的主要因素。按照二元相位图，在这三个元素之间有三种可能的二元共晶反应。
In the lead-free solder paste in composition, is mainly composed of tin / silver / copper is composed of three parts, made of silver and copper to replace the original lead composition. Fundamental properties and phenomena of the tin / silver / copper system, tin and minor elements ( silver and bronze ) between the metallurgical reaction is determined by temperature, curing mechanism and mechanical properties of main factors. According to the two phase diagram, in which three elements between three may two eutectic reaction.
而在温度动力学上更适于银或铜与锡反应，因此，锡/银/铜三重反应可预料包括锡基质相位、金属之间的化合相和金属间的化合相位。
In the temperature dynamics is more suitable for silver or copper and tin reaction, therefore, tin / silver / Bronze three response can be expected, including tin matrix phase between the metal compounds and metal compound phase.
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